Greetings from IEEE CAS BLR Chapter!!!
The Technical Committee of IEEE CAS BLR Chapter presents the 4th talk in its “Techno Talk” Series, a series of technical talks on cutting edge technologies and advanced research areas of Circuits and System. Techno Talks are based on a monthly theme to cover a wide range of technical topics. The Techno talk program delivers best in class technical sessions by eminent speakers, twice in a month.
The details of the upcoming technical talk are mentioned below.
Theme : Heterogenous Integration
Title: Power Distribution Network, Thermal and Reliability Challenges: going from FETs to the System in Heterogeneous World
Speaker: Dr. Palkesh Jain, Senior Director, Qualcomm
Date : 24th Mar 2023
Time : 4:15 – 5:30 PM (IST)
Venue : In person at Indian Institute of Science, Bangalore + Virtual (Webex link will be sent out)
Registration Charges: Free for all [Registration Ends: 22nd March, midnight, IST]
Registration Link:
[Mandatory to receive the meeting link]
This talk will provide a sneak peek into array of challenges: from FET to the system level, in heterogeneous designs – targeted towards multitude of diverse markets: automotive, smartphones and even compute. Some practical notes on how designs could be safeguarded against these at various stages: foundry, IP, SoC design, post-Si and system level will be discussed. We will also touch upon prevalent design methodologies in the multi-physics world and the challenges posed to them.
Dr. Palkesh Jain graduated from IIT Bombay with dual degree in Electrical Engg and holds a doctoral degree (cum laude) in CS from Universitat Politècnica de Catalunya, Barcelona. He worked with Texas Instruments India from 2004-14, where he and team delivered on Gigahertz enabling design reliability methodologies for several generations of OMAP, ASIC, DSP and automotive devices. He joined Qualcomm in 2014, where he currently serves as Senior Director, Tech. He and team have been focusing on thermal and PDN challenges for diverse Qualcomm designs. Palkesh has >25 awarded US patents and several publications in IEEE Transactions/conferences.
Certificates would be provided to all the attendees after the session. The recording of the session would be shared and accessible by the IEEE CAS Members only.